METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES

摘要

Method and apparatus for reducing metal oxide surfaces to modified metal surfaces are disclosed. Metal oxide surfaces are reduced to form a film integrated with a metal seed layer by contacting a solution with a reducing agent with the metal oxide surfaces. The solution with the reducing agent can contact the metal oxide surfaces under conditions that form an integrated film with the metal seed layer, and that reduces reoxidation from exposure the ambient environment. In some embodiments, an additive can be included with the reducing agent to form a surface protecting layer on the metal seed layer. In some embodiments, the metal is copper used in damascene copper structures.

主权项

1. A method of preparing substrate with a al seed layer for platting, the method comprising:
receiving a substrate having the metal seed layer on a plating surface of the substrate, wherein a portion of the metal seed layer has been converted to an oxide of the metal; contacting at least the oxide of the metal with a solution containing a reducing agent under conditions that reduce the oxide of the metal to the metal in the form of a film integrated with the seed layer; transferring the substrate to a plating bath containing a plating solution; and plating metal onto the metal seed layer using the plating solution.