MANUFACTURING METHOD OF ELECTRONIC APPARATUS INCLUDING RESIN SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for cutting a resin substrate without damaging a wiring pattern by laser beam irradiation.SOLUTION: A resin substrate is formed by: arranging an upper substrate 21 made of resin and a lower substrate 22 made of resin to face one another; encapsulating a liquid crystal coating film layer 28 with an adhesive member 23; providing, on an extension part 22b of the lower substrate 22, wires 29 connected to a conductive pattern provided on an inner surface of the upper substrate 21 and to a plurality of conductive patterns provided on an inner surface of the lower substrate 22; and bonding the upper substrate 21 and the lower substrate 22 with the adhesive member 23. A cutting step of irradiating an extension part 21b of the upper substrate 21 outside the adhesive member 23 with a laser beam along a predetermined cutting line part A to cut the resin substrate comprises: dividing the cutting line part A into two regions, and defining a region on which the wires 29 are arranged as a wire-cutting line part Ap and a region other than the wire-cutting line part Ap as a normal cutting line part An; and performing laser beam irradiation to cut the extension part 21b so that a cutting depth of the laser beam irradiation is shallower in the wire-cutting line part than that of the laser beam irradiation in the normal cutting line part.