SOLID STATE IMAGE PICKUP APPARATUS AND METHOD FOR MANUFACTURING THE SAME

摘要

When forming a hollow portion between each color filter, in order to realize the formation of the hollow portions with a narrower width, a plurality of light receiving portions are formed on the upper surface of a semiconductor substrate, a plurality of color filters corresponding to each of the light receiving portions are formed above the semiconductor substrate, a photoresist is formed on each color filter, side walls are formed on the side surfaces of the photoresist, and a hollow portion is formed between each color filter by performing etching using at least the side walls as a mask.

主权项

1. A method for manufacturing a solid state image pickup apparatus in which a plurality of light receiving portions are provided on a semiconductor substrate, comprising:
forming a plurality of color filters corresponding to each light receiving portion above the semiconductor substrate in such a manner as to contact each other; forming a photoresist having openings above the plurality of color filters; forming side walls on side surfaces of the photoresist; and forming a hollow portion between each color filter by performing etching using at least the side walls as a mask.