| 摘要 |
<p>The present invention relates to a device of placing minute solder balls on a substrate in a non-contact method and a method thereof. The device of placing minute solder balls on a substrate comprises a holder having a plurality of accommodating units on a predetermined position where solder balls are to be placed; a support for fixating and holding the holder; a solder ball providing machine for providing the solder balls for the holder; a first shaker for bounding and transferring the solder balls on the holder to a first direction by being placed below the support and shaking; and a second shaker for bounding and transferring the solder balls on the holder to a second direction which is opposite of the first direction by being placed below the support and shaking. Solder balls remaining on the holder of the support can be bounded and transferred to both directions by the shaking of the first and second shakers. Further, when the first and second shakers for shaking to bound and transfer the solder balls to different directions to each other are operated at the same time, the solder balls bound vertically at the same spot. In this way, on a spot where a double ball having two or more solder balls in one accommodating unit is placed, solder balls bound vertically at the same spot, so that workers can effectively solve double balls in a non-contact method without the contact with the workers.</p> |
