| 摘要 |
A heating device (1) for hot stamping is designed to heat a plated metallic material (9) while conveying the metallic material, and is provided with a first heating bath (3A) provided in a conveyance path (2) for the metallic material, and a second heating bath (3B) provided on the downstream side from the first heating bath in the conveyance path, the amount of heating by the second heating bath is set such that the temperature of the metallic material becomes an Ac3 point or more and less than the boiling point of the plating, and the amount of heating by the first heating bath is set larger than the amount of heating by the second heating bath. |
