发明名称 METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES INCLUDING AN INSULATIVE MATERIAL ON A SEMICONDUCTIVE MATERIAL, AND RELATED SEMICONDUCTOR DEVICE STRUCTURES AND SEMICONDUCTOR DEVICES
摘要 A method of forming a semiconductor device structure. The method comprises forming an insulative material on a semiconductive material, and microwave annealing at least an interface between the insulative material and the semiconductive material. Additional methods of forming a semiconductor device structure, and related semiconductor device structures and a semiconductor device are also described.
申请公布号 US2014199822(A1) 申请公布日期 2014.07.17
申请号 US201313741672 申请日期 2013.01.15
申请人 Shrotri Kunal 发明人 Shrotri Kunal
分类号 H01L21/02;H01L21/762 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of forming a semiconductor device structure, comprising: forming an insulative material on a semiconductive material; and microwave annealing at least an interface between the insulative material and the semiconductive material.
地址 Boise ID US