Method and Device for Purging Bubbles in the Pipeline of Substrate Coater and Corresponding Substrate Coater

摘要

The present invention provides a method for purging bubbles in the pipeline of a substrate coater, which at least comprises: activating an injection pump for a first time, the injection pump injecting a photoresist into the pipeline of the substrate coater from a storage container; driving the photoresist to flow in the pipeline of the substrate coater and proceeding a purging bubbles process once; closing the injection pump for a second time after finishing the purging bubbles process; and activating the injection pump again and repeating the purging bubbles process until all small bubbles in the pipeline of the substrate coater being purged after the small bubbles in the pipeline of the substrate coater accumulate in the second time. The present invention correspondingly discloses a device for purging bubbles in the pipeline of substrate coater and a substrate coater. According to the embodiment of the present invention, it can improve the purging bubbles efficiency in the pipeline and save the photoresist.

主权项

1. A device for purging bubbles in the pipeline of a substrate coater, wherein the device for purging bubbles in the pipeline comprises:
an injection pump, which is used to inject a photoresist into the pipeline of the substrate coater from a storage container; a controlling unit, which is used to activate the injection pump for a first time, driving the photoresist to flow in the pipeline of the substrate coater and proceeding a purging bubbles process once; after finishing the purging bubbles process, closing the injection pump for a second time; and after the small bubbles in the pipeline of the substrate coater accumulate in the second time, activating the injection pump again and repeating the purging bubbles process, until all small bubbles in the pipeline of the substrate coater being purged.