| 摘要 |
<p>A method for producing a wiring board, which comprises a step (1) wherein peelable copper foils, each of which has a copper foil (A) and a copper foil (B), are arranged on both sides of a prepreg (A) so as to sandwich the prepreg (A), and a prepreg (B) and a copper foil (C) are arranged and laminated on the outer side of each peelable copper foil, thereby forming a laminate with a supporting material. A laminate with a supporting material, wherein peelable copper foils, each of which has a copper foil (A) and a copper foil (B), are arranged on both sides of a prepreg (A) so as to sandwich the prepreg (A), and a prepreg (B) and a copper foil (C) are arranged and laminated on the outer side of each peelable copper foil.</p> |
