High-precision material processing device

摘要

The method involves providing laser pulses with a pulse length between 50 femto second and 1 pico second, with a pulse frequency from 50 kilo hertz and 1 mega hertz, and with a wavelength between 600 nanometer and 2000 nanometer for acting on a material e.g. eye, to be worked. The laser pulses are focused on or in the material, and the focal points are guided such that a cohesive cut surface is generated in the material. An independent claim is also included for an apparatus for precise working of material.