| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which displacement of a solder resist film can be detected. SOLUTION: The wiring board comprises the wiring board, a wiring layer including a pad with which an electronic component mounted on the surface of the wiring board is connected electrically and a displacement detection pattern, and a solder resist film 9 formed to cover the wiring layer. The solder resist film 9 has a displacement detection opening 10e for detecting displacement of the solder resist film, and an opening for exposing the pad. The detection pattern 6 is located on the outer peripheral side of the displacement detection opening 10e, and displacement of the solder resist film is detected by confirming the detection pattern from the displacement detection opening. COPYRIGHT: (C)2012,JPO&INPIT |
