| 发明名称 |
COMPOSITION FOR ELECTRONIC DEVICE |
| 摘要 |
The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality. |
| 申请公布号 |
EP2755234(A1) |
申请公布日期 |
2014.07.16 |
| 申请号 |
EP20120830834 |
申请日期 |
2012.09.07 |
| 申请人 |
HENKEL AG & CO. KGAA |
发明人 |
HORIGUCHI, YUSUKE;SANO, MIEKO;SATO, KENICHIRO |
| 分类号 |
H01L21/60;C08K7/16;C08K9/04;C08L25/18;C08L33/04;C09D4/00;C09D133/14;H01L23/29;H01L23/31 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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