<p>Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site.</p>
申请公布号
EP2754175(A1)
申请公布日期
2014.07.16
申请号
EP20120766497
申请日期
2012.08.27
申请人
ATI TECHNOLOGIES ULC;ADVANCED MICRO DEVICES, INC.
发明人
KW LEUNG, ANDREW;TOPACIO, RODEN, R.;HSIEH, YU-LING;LOW, YIP, SENG