APPARATUS FOR CUTTING A WAFER

摘要

The present invention relates to a wafer cutting device. The present invention comprises a loading stage including a body part with a wafer mounting part in which a wafer is mounted and a first position setting part formed on the body part; a handling cap including a coupling part with a second position setting part setting a position by being coupled to the first position setting part and a guide body part connected to the coupling part and has the penetrated inside; and a cutter moving along the guide body part and cutting the wafer put on the wafer seating part of the loading stage. The present invention has a simple configuration, cheap production costs, and a small size so as to require less installation space. Further, according to the present invention, the wafer can be precisely cut in a predetermined size and be easily cut.