| 摘要 |
The present invention relates to an apparatus and a method for molding an LED package, which can prevent the phenomenon of cutting and separating one side of a reflector when separating a middle plate after injecting a resin. According to an embodiment of the present invention, provided is the apparatus for molding the LED package, comprising a lead frame substrate; a lower mold for supporting the lead frame substrate from the lower part of the lead frame substrate and provided with a cavity on one side for forming a reflector on the lead frame substrate; and the middle plate interposed between the lead frame substrate and the lower mold and providing a gate for injecting the resin into the cavity, wherein the lead frame substrate corresponds to an outlet side of the gate to form a filling portion. |
