发明名称 Printed circuit board and manufacturing method of printed circuit board
摘要 <p>A printed circuit board includes a plurality of wiring layers and a plurality of differential signal vias to establish connections between the plurality of wiring layers through via pairs and to be disposed so that paired-vias possessed by a specified differential signal via for transmitting a differential signal different from a signal of another differential signal via adjacent thereto are arranged on a locus of a point distanced equally from each of the paired-vias possessed by another differential signal via.</p>
申请公布号 EP2755457(A1) 申请公布日期 2014.07.16
申请号 EP20130193842 申请日期 2013.11.21
申请人 FUJITSU LIMITED 发明人 KAWAI, KENICHI
分类号 H05K1/02 主分类号 H05K1/02
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