| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of controlling a substrate processing apparatus that can flexibly use an atmosphere created in a processing operation unit having been executed previously for a processing operation unit to be executed later in a predetermined processing chamber.SOLUTION: The method of controlling the substrate processing apparatus 10 including PMs 12 to 17 uses process jobs (PJ) as operation units corresponding to a process group comprising processings performed on respective wafers and having the same contents, and control jobs (CJ) as operation unit groups each comprising a plurality of PJs, wherein when a CJ that a PJ having been executed previously does not include a PJ that one PM can execute, a PJ which belongs to another CJ and can be executed by the PM is permitted to be executed. |
