摘要 |
The present invention provides a vapor deposition system for a film forming systems that promote an efficiency of utilizing an EL material and is excellent in uniformity or throughput of forming an EL layer and a vapor deposition method. According to the present invention, vapor deposition is carried out in a deposition chamber by moving an evaporation source holder 903 on which six containers 911 filled with an evaporation material are set at a certain pitch with respect to the substrate. The evaporation holder 903 is transported from an installation chamber 905 by a transport mechanism 902 b. A heater is provided in a turntable 907 . Throughput can be improved by heating the evaporation holder 903 in advance of transporting containers into the evaporation holder 903. |