| 摘要 |
A method comprises shaping an aluminum oxide ceramic material into a component (12) for an electronic device (10). The component has first and second major surfaces (56A,56B). A selected region (52) of one or both of the first and second major surfaces is heated to an annealing temperature. The selected region (52) is then cooled below the annealing temperature, so that residual compressive stress is generated in the selected region (52). |
