| 摘要 |
The present invention relates to a pressure sensor package and a manufacturing method thereof. The pressure sensor package includes a pressure sensor element which applies MEMS technology. In the pressure sensor package, a mold member is stacked on the upper part of a substrate where component elements including the pressure sensor element are mounted. The mold member is molded out of an insulating material through injection molding and fixed to form the external shape of the pressure sensor package in order to protect the component elements mounted on the substrate. In addition, the mold member transmits a pressure signal from the outside to the pressure sensor element. The coherence between the mold member and the substrate can be improved, and the mold member can be injection-molded in various shapes. Thus, the pressure sensor package can be manufactured in various shapes, corresponding to the application thereof. Therefore, by using the mold member, the manufacturing process of the package can be simplified and the manufacturing costs can be reduced. |
