HEIGHT MEASUREMENT APPARATUS OF SUBSTRATE BUMP AND MEASUREMENT METHOD BY USING THE SAME

摘要

Provided in the present invention is an apparatus for measuring the height of a bump on a substrate, which comprises: a laser beam radiation unit which radiates laser beams to the surface of a substrate and the top of a bump formed on the substrate; and a laser beam input unit which is inputted with the laser beams reflected by the surface of the substrate and the top of the bump, in order to measure the height of the bump according to an optical triangulation method. The laser beam radiation unit and the laser beam input unit can rotate on the bump. In addition, provided in the present invention is a method for measuring the height of a bump on a substrate, which comprises as follows: a laser beam radiation step where the surface of a substrate and the top of a bump formed on the substrate are radiated with laser beams from the laser beam radiation unit; and a height measurement step where the laser beams reflected by the surface of the substrate and the top of the bump formed on the substrate pass a light collecting lens and are inputted into the laser beam input unit, in order to measure the height of the bump on the substrate according to the optical triangulation method. The laser beam radiation unit and the laser beam input unit can rotate on the bump on the substrate.