| 摘要 |
The present invention relates to a wheel assembly which distributes and supplies the uniform amount of cooling water to a wheel tip for grinding, and a wafer grinding apparatus using the same. The present invention includes a plate-shaped wheel body; a wheel tip which is formed on the bottom surface of the wheel body and grinds the surface of a wafer; a plurality of cooling holes which is arranged at a constant distance in the wheel body; and a cooling line installed on the bottom surface of the wheel body to connect the cooling holes. The present invention provides the wheel assembly of the wafer grinding apparatus which supplies the cooling water to the bottom surface of the wheel body through the cooling holes and the cooling line. Also, the present invention provides a chuck table which supports the wafer; and a wheel assembly which grinds the wafer fixed to the chuck table and has the cooling line which enables the cooling water to overflow and uniformly supplies the overflowing cooling water to one surface facing the wafer. |
