| 摘要 |
<p>The invention discloses a bearing plate for manufacturing a semiconductor chip. The bearing plate comprises a chip retaining area arranged in a preset area of the bearing plate and provided with a plurality of through holes for inserting and fixing the semiconductor chip into a metallic plate, and an absorption area which is arranged on the outside portion of the chip retaining area and used for absorption and fixing by absorbing washers, wherein a plurality of non-linear grooves for increasing the adhesion force between the substrate (metallic plate) and silicon are formed on the upper and lower surfaces of the absorption area. According to the preferred embodiments, the adhesion force between the substrate (metallic plate) and silicon of the bearing plate is increased during formation of the silicon, when the surface of the absorption area on the outside portion of the chip retaining area of the bearing plate is processed with non-linear structure through full-etching and semi-etching means different from conventional means.</p> |
