Conical sponge brush for cleaning semiconductor wafers

摘要

A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

主权项

1. A method for cleaning a substrate, the method comprising:
engaging a substrate with a cleaning device including a brush core positioned about a first axis and a brush including an outer surface and a hollow bore defined in the brush around the brush core, the brush also includes a first end opposed to a second end, and wherein a cross-sectional area of the brush when taken perpendicular to the first axis increases from the first end to the second end; rotating the brush about the first axis in a first rotational direction; rotating the substrate about a second axis in a second rotational direction; wherein the second axis intersects the first axis, and wherein points formed linearly along the outer surface from the first end of the brush to the second end of the brush each travel at a respective first linear velocity, wherein the first linear velocities are tangential to the first rotational direction and are increasing from the first end of the brush to the second end of the brush; and wherein points formed radially along the substrate from an outer edge of the substrate to a center of the substrate each travel at a respective second linear velocity, wherein the second linear velocities are tangential to the second rotational direction and are decreasing from the outer edge of the substrate to the center of the substrate.