Plug connector modules

摘要

A plug connector module that includes a metal frame having a base portion, an insertion end and a cavity that extends from the base portion into the insertion end. The insertion end is configured to be inserted into a cavity of a corresponding receptacle connector. A substrate extends through the base portion of the frame and into the insertion end. A first plurality of external contacts is positioned in a first opening and a second plurality of contacts positioned within a second opening. One or more electronic components is coupled to the substrate, and a first encapsulant that covers and environmentally seals the one or more electronic components. A second encapsulant covers and environmentally seals a metal shield and at least a portion of a leg that extends from the shield.

主权项

1. A plug connector module comprising:
a metal frame having a base portion, an insertion end and a cavity that extends from the base portion into the insertion end, the insertion end being configured to be inserted into a cavity of a corresponding receptacle connector and having width, height and length dimensions along with first and second opposing exterior surfaces extending in the width and length dimensions, the first exterior surface including a first opening and the second exterior surface including a second opening directly opposite the first opening; a substrate that extends through the base portion of the frame and into the insertion end, the substrate having a plurality of contact bonding pads at one end positioned within the frame, a plurality of conductor bonding pads at the opposing end and at least one ground pad contact between the contact bonding pads and conductor bonding pads; a first plurality of external contacts positioned within the first opening and bonded to some of the plurality of contact bonding pads on the substrate; a second plurality of contacts positioned within the second opening and bonded to some of the plurality of contact bonding pads on the substrate; one or more electronic components coupled to the substrate; a first encapsulant that covers and environmentally seals the one or more electronic components; a metal shield coupled to the base portion of the metal frame and encasing a portion of the substrate and the one or more electronic components, the metal shield having a leg that is substantially perpendicular to the substrate and coupled to the substrate at the ground pad; and a second encapsulant that covers and environmentally seals the ground pad and at least a portion of the leg.