| 发明名称 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | ||
| 摘要 | Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece. | ||
| 申请公布号 | US8778732(B2) | 申请公布日期 | 2014.07.15 |
| 申请号 | US201113171137 | 申请日期 | 2011.06.28 |
| 申请人 | Micron Technology, Inc. | 发明人 | Lee Teck Kheng;Chai David Yih Ming;Ng Hong Wan |
| 分类号 | H01L21/00;H01L21/44;H01L23/02 | 主分类号 | H01L21/00 |
| 代理机构 | Perkins Coie LLP | 代理人 | Perkins Coie LLP |
| 主权项 | 1. A method for making a microelectronic support device, comprising: positioning a support contact to be recessed from a side of a support member; creating a passageway extending between an aperture in the side of the support member and a surface of the support contact, the surface of the support contact being accessible through the aperture and the passageway; and connecting a bond wire to the surface of the support contact so that at least a portion of the bond wire extends through the aperture. | ||
| 地址 | Boise ID US | ||