Method of manufacturing light emitting device

摘要

A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

主权项

1. A method of manufacturing a light-emitting diode (“LED”) device comprising:
die-attaching an LED chip to a first portion of a substrate; electrically connecting a first terminal of the LED chip to a first lead of the LED device, wherein, said first lead extends from the substrate first portion; dispensing uncured elastomeric encapsulant into a receptacle of the LED device through an aperture of the receptacle; inserting the LED chip and substrate first portion through the aperture so as to surround the LED chip and the substrate first portion with elastomeric encapsulant; and curing the elastomeric encapsulant.