发明名称 Electronic circuit
摘要 Electronic circuits (1, 101) are disclosed. The electronic circuits comprise a first and a second integrated circuit (10a, 110a, 10b, 110b) and a printed circuit board (PCB) (15, 115). The PCB comprises dielectric layers (30a-c, 130) of polymer-based materials having different dissipation factors arranged in accordance with various embodiments for suppressing noise.
申请公布号 US8779298(B2) 申请公布日期 2014.07.15
申请号 US201013387421 申请日期 2010.06.17
申请人 St-Ericsson SA 发明人 Asterland Richard
分类号 H05K1/00 主分类号 H05K1/00
代理机构 Patent Portfolio Builders PLLC 代理人 Patent Portfolio Builders PLLC
主权项 1. An electronic circuit comprising: a first and a second integrated circuit; and a printed circuit board comprising: a first insulation layer of a first dielectric material comprising a polymer; a second insulation layer of a second dielectric material comprising a polymer; a first conduction layer comprising an electrically conductive material forming a first plane on a first surface of the first insulation layer and on a first surface of the second insulation layer, the first conduction layer supplying a first supply voltage to the first and the second integrated circuit; a second conduction layer comprising an electrically conductive material forming a second plane on a second surface, opposite to said first surface, of the first insulation layer for supplying a second supply voltage to the first and the second integrated circuit; a third conduction layer comprising an electrically conductive material forming one or more signal wires, for conveying electrical signals to and/or from the first and/or the second integrated circuit, on a second surface, opposite to said first surface, of the second insulation layer; a first via of electrically conductive material connected to the first plane and passing through the first insulation layer and the second conduction layer, for providing the first supply voltage to the first integrated circuit; and a second via of electrically conductive material connected to the first plane and passing through the first insulation layer and the second conduction layer, for providing the first supply voltage to the second integrated circuit; wherein the first dielectric material has a higher dissipation factor than the second dielectric material.
地址 Plan-les-Ouates CH