发明名称 |
Bump structures for multi-chip packaging |
摘要 |
The mechanisms for forming a multi-chip package described enable chips with different bump sizes being packaged to a common substrate. A chip with larger bumps can be bonded with two or more smaller bumps on a substrate. Conversely, two or more small bumps on a chip may be bonded with a large bump on a substrate. By allowing bumps with different sizes to be bonded together, chips with different bump sizes can be packaged together to form a multi-chip package. |
申请公布号 |
US8779588(B2) |
申请公布日期 |
2014.07.15 |
申请号 |
US201213427753 |
申请日期 |
2012.03.22 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Lin Jing-Cheng |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
Lowe Hauptman & Ham, LLP |
代理人 |
Lowe Hauptman & Ham, LLP |
主权项 |
1. A chip package, comprising:
a first bump structure between a first chip and a substrate of the chip package, wherein a first solder layer of the first bump structure surrounds more than one bump on the substrate, and the solder layer covers an entirety of each sidewall of each bump of the more than one bump. |
地址 |
TW |