Heat dissipating semiconductor device packages

摘要

An embodiment of a method for making semiconductor device packages includes a heat sink matrix and a substrate. A plurality of semiconductor devices are attached to the substrate. Then, a package body is formed between the heat sink matrix and the substrate, wherein the package body encapsulates the semiconductor devices. Then, a plurality of first cutting slots is formed, wherein the first cutting slots extend through the heat sink matrix and partially extend into the package body. Then, a plurality of second cutting slots is formed, wherein the second cutting slots extend through the substrate and through the package body to the first cutting slot, thereby singulating the heat sink matrix and substrate into a plurality of individual semiconductor device packages.

主权项

1. A semiconductor device package, comprising:
a substrate including a first surface; a semiconductor device is attached to the first surface of the substrate; a package body disposed on the first surface of the substrate and covering at least the semiconductor device, the package body including a first portion having a first lateral surface and a second portion having a second lateral surface that is not coplanar with the first lateral surface; and a heat dissipation unit disposed on the package body; wherein the first lateral surface is substantially coplanar with a lateral surface of the heat dissipation unit, and the second lateral surface is substantially coplanar with a lateral surface of the substrate.