发明名称 |
Chip package structure and manufacturing method thereof |
摘要 |
An embodiment of the present invention provides a manufacturing method of a chip package structure including: providing a first substrate having a plurality of predetermined scribe lines defined thereon, wherein the predetermined scribe lines define a plurality of device regions; bonding a second substrate to the first substrate, wherein a spacing layer is disposed therebetween and has a plurality of chip support rings located in the device regions respectively and a cutting support structure located on peripheries of the chip support rings, and the spacing layer has a gap pattern separating the cutting support structure from the chip support rings; and cutting the first substrate and the second substrate to form a plurality of chip packages. Another embodiment of the present invention provides a chip package structure. |
申请公布号 |
US8779558(B2) |
申请公布日期 |
2014.07.15 |
申请号 |
US201313829802 |
申请日期 |
2013.03.14 |
申请人 |
|
发明人 |
Lee Hung-Jen;Chang Shu-Ming;Chiang Chen-Han;Liu Tsang-Yu;Ho Yen-Shih |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
Liu & Liu |
代理人 |
Liu & Liu |
主权项 |
1. A chip package structure, comprising:
a first substrate; a second substrate disposed on the first substrate; and a spacing layer disposed between the first substrate and the second substrate to separate the first substrate from the second substrate, wherein the spacing layer has a chip support ring and an outer wall structure located on a periphery of the chip support ring, and the chip support ring and the outer wall structure are separated from each other by a gap therebetween. |
地址 |
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