| 发明名称 | Compact, highly integrated microphone assembly | ||
| 摘要 | A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly. | ||
| 申请公布号 | US8781140(B2) | 申请公布日期 | 2014.07.15 |
| 申请号 | US201213446644 | 申请日期 | 2012.04.13 |
| 申请人 | Knowles Electronics, LLC | 发明人 | Lautenschlager Eric J.;Kirkpatrick Galen |
| 分类号 | H04R25/00 | 主分类号 | H04R25/00 |
| 代理机构 | Fitch, Even, Tabin & Flannnery LLP | 代理人 | Fitch, Even, Tabin & Flannnery LLP |
| 主权项 | 1. A microelectomechanical (MEMS) microphone assembly, the assembly comprising: a MEMS structure, the MEMS structure including a diaphragm that responds to changes in sound pressure, the MEMS structure contributing to a vertical dimension of the assembly; a base portion, the MEMS structure being supported by the base portion; and a lid, the lid covering the MEMS structure, such that a portion of the MEMS structure at least in part defines a boundary to the external environment of the assembly, the portion extending through a side wall of the assembly. | ||
| 地址 | Itasca IL US | ||