Solder bump connections

摘要

Solder bump connections and methods for fabricating solder bump connections. The method includes forming a layer stack containing first and second conductive layers, forming a dielectric passivation layer on a top surface of the second conductive layer, and forming a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer. The method further includes forming a conductive plug in the via opening. The solder bump connection includes first and second conductive layers comprised of different conductors, a dielectric passivation layer on a top surface of the second conductive layer, a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer, and a conductive plug in the via opening.

主权项

1. A method of fabricating a solder bump connection, the method comprising:
forming a layer stack containing a first conductive layer and a second conductive layer on the first conductive layer; forming a dielectric passivation layer in an island region on a top surface of the second conductive layer, wherein the island region includes an inner sidewall and an outer sidewall; forming a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer and circumscribed by the inner sidewall of the island region; forming a conductive plug in the via opening that is coupled by the second conductive layer with the first conductive layer; and after the conductive plug is formed, removing field regions of the layer stack outside of the outer sidewall of the island region with a selective wet chemical etching process.