发明名称 |
Two-wafer MEMS ionization device |
摘要 |
A microelectromechanical system (MEMS) assembly includes at least one emission source; a top wafer having a plurality of side walls and a generally horizontal portion, the horizontal portion having a thickness between a first side and a directly opposed second side, at least one window in the horizontal portion extending between the first and second sides and a transmission membrane across the at least one window; and a bottom wafer having a first portion with a first substantially planar surface, an intermediate surface directly opposed to the first substantially planar surface, a second portion with a second substantially planar surface, the at least one emission source provided on the second substantially planar surface; where the top wafer bonds to the bottom wafer at the intermediate surface and encloses a cavity within the top wafer and the bottom wafer. |
申请公布号 |
US8779531(B2) |
申请公布日期 |
2014.07.15 |
申请号 |
US201113338425 |
申请日期 |
2011.12.28 |
申请人 |
UTC Fire & Security Corporation |
发明人 |
Mantese Joseph V.;Vincitore Antonio M. |
分类号 |
H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP |
主权项 |
1. A microelectromechanical system (MEMS) assembly comprising:
at least one emission source; a top wafer having a plurality of side walls and a horizontal portion, the horizontal portion having a thickness between a first side and a directly opposed second side, at least one window in the horizontal portion extending between the first and second sides and a transmission membrane across the at least one window; and a bottom wafer having a first portion with a first planar surface, an intermediate surface directly opposed to the first planar surface, a second portion with a second planar surface, the at least one emission source provided on the second planar surface; wherein the top wafer bonds to the bottom wafer at the intermediate surface and encloses a cavity within the top wafer and the bottom wafer; wherein the at least one emission source includes microneedles formed on the bottom wafer, the microneedles being of the same material as the bottom wafer. |
地址 |
Farmington CT US |