System and method for temperature cycling

摘要

A system and method for non-isothermal temperature cycling (also called Conduction Temperature Cycling) of a semiconductor device. The method includes inserting a semiconductor device into a testing chamber and thermally coupling the semiconductor device to a heating and cooling element via a vacuum holding component. The method further includes heating and cooling a die portion of the semiconductor device with the heating and cooling element and testing the semiconductor device for component failure caused by thermo-mechanical stress induced by the non-isothermal temperature cycling. In one embodiment, the heating and cooling comprises non-isothermal temperature cycling.

主权项

1. A method of testing a semiconductor device comprising:
loading said semiconductor device into a testing chamber, said semiconductor device comprising a die and a substrate; positioning said die proximate to a heating and cooling element via a vacuum holding component; locally heating and cooling said die with said heating and cooling element through non-isothermal temperature cycling, wherein said non-isothermal temperature cycling comprises a number of heating-cooling cycles; and testing said semiconductor device for component failure caused by thermo-mechanical stress induced by said non-isothermal temperature cycling.