发明名称 Magnetic tunneling junction seed, capping, and spacer layer materials
摘要 In one embodiment, a magnetic element for a semiconductor device includes a reference layer, a free layer, and a nonmagnetic spacer layer disposed between the reference layer and the free layer. The nonmagnetic spacer layer includes a binary, ternary, or multi-nary alloy oxide material. The binary, ternary, or multi-nary alloy oxide material includes MgO having one or more additional elements selected from the group consisting of: Ru, Al, Ta, Tb, Cu, V, Hf, Zr, W, Ag, Au, Fe, Co, Ni, Nb, Cr, Mo, and Rh.
申请公布号 US8779538(B2) 申请公布日期 2014.07.15
申请号 US201213491568 申请日期 2012.06.07
申请人 Samsung Electronics Co., Ltd. 发明人 Chen Eugene Youjun;Tang Xueti
分类号 H01L27/22;H01L29/04;H01L47/00;G11B5/33;G11B5/127 主分类号 H01L27/22
代理机构 Renaissance IP Law Group LLP 代理人 Renaissance IP Law Group LLP
主权项 1. A magnetic element for a semiconductor device, comprising: a first reference layer; a free layer; a first nonmagnetic spacer layer disposed between the first reference layer and the free layer; and a seed layer arranged beneath the first reference layer; wherein the seed layer comprises a binary, ternary, or multi-nary alloy oxide material, where the binary, ternary, or multi-nary alloy oxide material comprises MgO having one or more additional elements selected from the group consisting of: Ru, Al, Ta, Tb, Cu, V, Hf, Zr, W, Ag, Au, Fe, Co, Ni, Nb, Cr, Mo, and Rh.
地址 KR