| 发明名称 | Stackable integrated circuit package system | ||
| 摘要 | A stackable integrated circuit package system including mounting an integrated circuit device over a package carrier, mounting a stiffener over the package carrier and mounting a mountable package carrier over the stiffener with a vertical gap between the integrated circuit device and the mountable package carrier. | ||
| 申请公布号 | US8779570(B2) | 申请公布日期 | 2014.07.15 |
| 申请号 | US200812051469 | 申请日期 | 2008.03.19 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Shim Seong Bo;Kang TaeWoo;Kang Yong Hee |
| 分类号 | H01L23/02;H01L23/12;H01L23/34;H01L23/48;H01L23/52;H01L23/40;H01L23/28;H01L21/00 | 主分类号 | H01L23/02 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A stackable integrated circuit package system comprising: an integrated circuit device mounted over a package carrier; a stiffener mounted over the package carrier, the stiffener is a metallic single body unit continuously surrounding a perimeter of the integrated circuit device; a mountable package carrier mounted on the stiffener includes a vertical gap between the integrated circuit device and the mountable package carrier, wherein the stiffener is in contact with the mountable package carrier outside of a vertical sidewall perimeter of the integrated circuit device; and intra-stack interconnects coupled, in a double row around the stiffener, between the package carrier and the mountable package carrier. | ||
| 地址 | Singapore SG | ||