Integrated circuit die stacks having initially identical dies personalized with switches

摘要

Integrated circuit die stacks having a first die mounted upon a substrate, the first die manufactured to be initially identical to a second die with a plurality of through silicon vias (‘TSVs’), the first die personalized by opening switches on the first die, converting the TSVs previously connected through the open switches into pass-through vias (‘PTVs’), each PTV implementing a conductive pathway through the first die with no connection to any circuitry on the first die; and the second die, manufactured to be initially identical to the first die and later personalized by opening switches on the second die, the second die mounted upon the first die so that the PTVs in the first die connect signal lines from the substrate through the first die to TSVs in the second die.

主权项

1. An integrated circuit die stack comprising:
a first die mounted upon a substrate, the first die manufactured to be initially identical to a second die with a plurality of through silicon vias (‘TSVs’), the TSVs connected through switches to electronic circuitry on the first die, the first die personalized by opening on the first die one or more of the switches, converting the TSVs previously connected through the open switches into pass-through vias (‘PTVs’), each PTV comprising a conductive pathway through the first die with no connection to any circuitry on the first die; the second die, manufactured to be initially identical to the first die and later personalized by opening switches connecting TSVs to circuitry on the second die, the second die mounted upon the first die so that the PTVs in the first die connect signal lines from the substrate through the first die to TSVs in the second die, each TSV on the second die comprising a conductive pathway through the second die that is also connected to electronic circuitry on the second die; a first die substack mounted upon the substrate, the first substack comprising two or more dies manufactured to be initially identical to dies in a second die substack with TSVs, the TSVs connected through switches to electronic circuitry on each of the dies of the first substack, the dies of the first substack personalized by opening on the dies of the first substack a number of same switches in each die of the first substack, converting the TSVs previously connected through the open switches into PTVs, each of the dies in the first substack stacked directly upon one another with no rotation and no shift in position with respect to one another; and the second substack, the second substack comprising dies manufactured to be initially identical to the dies of the first substack and later personalized by opening same switches in the dies of the second substack, each of the dies in the second substack stacked directly upon one another with no rotation and no shift in position with respect to one another, the second substack mounted upon the first substack so that the PTVs in the first substack connect conductors from the substrate through the first substack to TSVs in the second substack.