发明名称 Engineering resin thermoplastic silicone vulcanizates
摘要 A method for preparing a modified thermoplastic resin by mixing a thermoplastic resin having a tg of 95° C. or greater and having a melt processing temperature of 250° C. or greater with a silicone base comprised of 100 parts by weight of a diorganopolysiloxane gum and having an average of at least 2 alkenyl groups per molecule in conjunction with 0 to 50 parts by weight of a reinforcing filler along with a radical initiator. The silicone base and this combination are dynamically vulcanized to cure the silicone base at an elevated temperature.
申请公布号 US8779073(B2) 申请公布日期 2014.07.15
申请号 US201012925786 申请日期 2010.10.29
申请人 发明人 Mehta Veerag;Romanesko David
分类号 C08L83/04;C08L67/00;C08K3/00;C08G77/20 主分类号 C08L83/04
代理机构 代理人
主权项 1. A method for preparing a modified thermoplastic resin, said method comprising: (I) mixing (A) a thermoplastic resin having a tg of 95° C. or greater and having a melt processing temperature of 250° C. or greater;(B) a silicone base comprising: (i) 100 parts by weight of a diorganopolysiloxane gum having a plasticity of at least 30 and having an average of at least 2 alkenyl groups per molecule and(ii) 0 to 50 parts by weight of a reinforcing filler for every 100 parts of diorganopolysiloxane gum, wherein the weight ratio of said silicone base to said thermoplastic resin is from 0.5:99.5 to 85:15;(C) 0.01 to 5 parts by weight of a radical initiator for every 100 parts by weight of the silicone base, and(D) an adhesion additive, and (II) dynamically vulcanizing said silicone base at an elevated temperature, wherein the thermoplastic resin is selected from the group consisting of: Liquid Crystal Polymers, Polysulfone, Polyphenylsulfone, Polyethersulfone, Polyetherketone, Polyether-etherketone, Polyetherketoneketone, Polyethylenenaphthalate, Polyether-block-amide, Polyether-block-copolyamid, Polyether-block-copolymer, Polyester-block-ether, Polyester-block-copolymer, Polyphenylene ether, Polyphthalamide, Polyarylamid, Polyimide, Polyamideimide, Polyethernitrile, Polycyclohexylene-dimethylene terephthalate, clohexylenedimethylene terephthalate acid, and acrylonitrile styrene acrylate.
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