Semiconductor package having passive device and method for making the same

摘要

The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, a first capacitor, a first protective layer, a first metal layer and a second protective layer. The substrate has at least one via structure. The first capacitor is disposed on a first surface of the substrate. The first protective layer encapsulates the first capacitor. The first metal layer is disposed on the first protective layer, and includes a first inductor. The second protective layer encapsulates the first inductor. Whereby, the first inductor, the first capacitor and the via structure are integrated into the semiconductor package, so that the size of the product is reduced.

主权项

1. A method for making a semiconductor package, comprising the steps of:
(a) providing a base material, wherein the base material comprises at least one groove and at least one conductive via structure; (b) forming a first capacitor on the base material, wherein the first capacitor comprises a first lower electrode, a first dielectric layer and a first upper electrode, the first lower electrode is disposed on the base material, the first dielectric layer is disposed on the first lower electrode, and the first upper electrode is disposed on the first dielectric layer; (c) forming a first protective layer, so as to encapsulate the first capacitor, wherein the first protective layer comprises a plurality of first openings, and the first openings expose the conductive via structure, part of the first lower electrode and part of the first upper electrode; (d) forming a first metal layer on the first protective layer, wherein the first metal layer comprises a first inductor, a first interconnection metal, a second interconnection metal and a third interconnection metal, the first interconnection metal directly contacts the through via structure, the second interconnection metal directly contacts the first lower electrode, and the third interconnection metal directly contacts the first upper electrode; and (e) forming a second protective layer, so as to encapsulate the first inductor.