发明名称 Image-assisted system for adjusting a bonding tool
摘要 A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.
申请公布号 US8777086(B2) 申请公布日期 2014.07.15
申请号 US201213451622 申请日期 2012.04.20
申请人 ASM Technology Singapore Pte. Ltd. 发明人 Deng Jiang Wen;Chang Hei Lam;Mak Tim Wai
分类号 B23K31/02;B23K37/00 主分类号 B23K31/02
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A method for adjusting a bonding tool to a desired operational position, comprising the steps of: viewing the bonding tool with an image-capturing device located on one side of the bonding tool, and displaying a plurality of images of the bonding tool as viewed by the image-capturing device on a display screen; superimposing onto each of the plurality of images of the bonding tool displayed on the display screen a corresponding image of a reference bonding tool showing the desired operational position of the bonding tool; and thereafter adjusting the position of the bonding tool with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool, wherein the step of viewing the bonding tool with the image-capturing device includes moving the image-capturing device such that a beam splitter is interposed between the image-capturing device and the bonding tool in order to view a side surface of the bonding tool with the image-capturing device and moving the image-capturing device and the beam splitter such that the beam splitter is located underneath the bonding tool in order to view a bottom surface of the bonding tool with the image-capturing device, in order to obtain multiple images of the bonding tool comprising side and bottom views of the bonding tool, and the step of adjusting the position of the bonding tool with the adjustment mechanism comprises adjusting a rotary orientation of the bonding tool based upon the alignment of the multiple images of the bonding tool with the corresponding superimposed images of the reference bonding tool.
地址 Singapore SG