Structure designs and methods for integrated circuit alignment

摘要

Devices and methods for pattern alignment are disclosed. In one embodiment, a semiconductor device includes a die including an integrated circuit region, an assembly isolation region around the integrated circuit region, and a seal ring region around the assembly isolation region. The device further includes a die alignment mark disposed within the seal ring region or the assembly isolation region.

主权项

1. A semiconductor device, comprising:
a die including an integrated circuit region, an assembly isolation region around the integrated circuit region, and a seal ring region around the assembly isolation region; and a plurality of die alignment marks disposed within the seal ring region or the assembly isolation region, wherein the plurality of die alignment marks disposed within the seal ring region are alternately disposed adjacent an outer edge of the seal ring region and an inner edge of the seal ring region.