发明名称 Multi-band sensors
摘要 Designs of multi-band sensor array to generate multi-spectral images are disclosed. According to one aspect of the present invention, a multi-band sensor array includes one linear sensor configured to sense a scene in panchromatic spectrum to produce a panchromatic (PAN) sensing signal, and four color-band linear sensors to sense the same scene in different color bands to produce respective sensing signals. These sensors are packaged in a single module that is disposed on a single optical plane when used to scan a scene. A multi-spectral image is produced by combining these sensing signals. Further a unique packaging of the sensor array and a combination of soft and hard PCB are disclosed to withstand extremes in a harsh environment.
申请公布号 US8780242(B2) 申请公布日期 2014.07.15
申请号 US201213555101 申请日期 2012.07.21
申请人 CMOS Sensor Inc. 发明人 Wang Weng Lyang;Lin Shengmin
分类号 H04N3/14;H04N5/335 主分类号 H04N3/14
代理机构 代理人 Zheng Joe
主权项 1. A camera system comprising: an image sensor array including at least one first linear sensor configured to sense a predefined spectrum to produce a first sensing signal,a plurality of second linear sensors, each of the second linear sensors configured to sense a predefined band of spectrum, wherein the second linear sensors produce respectively a plurality of second sensing signals, anda pair of supporting circuits designated to read out sensor signals alternatively from even pixels and odd pixels of the at least one first linear sensor to produce the first sensing signal from the at least one first linear sensor; a readout circuit; and a multi-layer structure formed by two hard rigid printed circuit boards and a soft flexible printed circuit board, wherein the at least one first linear sensor and the second linear sensors, arranged collectively in a column on a same plane, are packaged in a single module and produce respectively the first sensing signal and the second sensing signals when the module is caused to have a movement relative to a scene being scanned, and the single module is packaged in a ceramic structure and has at least one array of pins, the ceramic structure is built in with a resistor network for LVDS (low voltage differential signaling) matching and a capacitance network for a sensor power supply to reduce noise, the image sensor array is coupled to the readout circuit by the multi-layer structure, the soft flexible printed circuit board is sandwiched by the two hard rigid printed circuit boards, and each of the hard rigid printed circuit boards is used to accommodate parts of the readout circuit while the soft flexible printed circuit board is used for coupling outputs of the image sensor array to the hard rigid printed circuit boards.
地址 Cupertino CA US