SUBSTRATE FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE PACKAGE USING THE SAME

摘要

The present invention relates to a substrate for manufacturing a light emitting device package and a method of manufacturing a light emitting device package using the same. A substrate for manufacturing a light emitting device package includes a substrate having a first surface with a plurality of mounting regions for a light emitting device and a second surface opposite to the first surface; a plurality of first and second electrode patterns formed on each mounting region in the first surface of the substrate; a plurality of first and second electrode pads formed on a region corresponding to each mounting region in the second surface of the substrate; first and second through electrodes formed through the substrate to connect the first and second electrode patterns to the first and second electrode pads, respectively; at least one first test electrode formed on the first surface of the substrate to connect a part of the first electrode patterns located in one direction of the substrate; and at least one second test electrode formed on the second surface of the substrate to connect a part of the second electrode pads located in another direction of the substrate. A color characteristic difference between separate light emitting devices is reduced and thus uniform color characteristics are represented.