METHOD FOR MANUFACTURING SUBSTRATE HAVING BUILT-IN COMPONENT, AND SUBSTRATE HAVING BUILT-IN COMPONENT MANUFACTURED USING SAME

摘要

The method includes the steps of: positioning an electronic component (14) using main marks (A and B) formed on a metal layer (4) as references and mounting the electronic component (14) on a second surface (5) of the metal layer (4) with an adhesive layer (18) interposed between the metal layer (4) and both of the electronic component (14) and terminals (20); then burying the electronic component (14) and the main marks (A and B) in an insulating substrate (34); then removing part of the metal layer (4) and forming a first window (W1) for exposing the main marks (A and B) therefrom and a second window (W2) for exposing the adhesive layer (18) including a position corresponding to the terminal (20) therefrom; then determining the position of the terminal (20) using the exposed main marks (A and B) as references and forming a laser via hole LVH (46) reaching the terminal (20) in the adhesive layer (18) exposed from the second window (W2); and thereby forming a wiring pattern (50) from the metal layer (4) electrically connected to the terminal (20) through a first conductive via (47) formed by plating the LVH (46) with copper.