| 摘要 |
The present invention relates to a mold carrier for performing a forming by injecting a foam resin and, more specifically, includes: a lower plate having fastening bumps on the top surface on an end of the mold carrier; an upper plate having a rotatable structure hinged with the lower plate by a hinge portion and a structure for supporting an upper mold opened downward to include a foam resin on the bottom, while having a vertical frame facing down on an end portion and including insertion bumps protruded toward the inside on the end portion of the vertical frame; a middle plate positioned between the lower plate and upper plate to be coupled with the upper mold of the upper plate to include a foam resin by supporting a lower mold opened upward; and a coupling device positioned on the top surface of the lower plate and moved back and forth by a driving instrument, while coupling the upper plate with the lower plate by the coupling between the fastening bumps of the lower plate and the insertion bumps of a bumpy member formed on the upper plate. According to the mold carrier of the present invention having the above objective, the coupling device is doubly or triply coupled to make the upper and lower molds withstand a thermal expansion pressure of the foam resins, and, by having a structure wherein the upper and lower molds are coupled by the driving instrument for adding up a driving force, an efficient automated production method can be adopted to contribute to a feasible mass production. |
