SILVER PASTE FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD

摘要

The present invention relates to silver paste for manufacturing a flexible printed circuit board and a printed circuit board manufactured using the same. The silver paste for manufacturing a flexible printed circuit board comprises: silver powder; a polymer resin; and a solvent, wherein the particle size of the silver powder ranges from 0.1 μm to 4.5 μm. The production costs of the flexible printed circuit board are reduced and productivity thereof is increased via a process that is simple and easy compared with an existing method for etching a copper foil of a high-priced FCCL, by enabling a user to manufacture the flexible printed circuit board by printing a circuit pattern on a substrate and sintering the substrate at low temperatures.