FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

摘要

The present invention relates to a flexible printed circuit board and a method for manufacturing the same, by forming a circuit pattern with a conductive paste on one surface of a base material and sintering the circuit pattern at a temperature of 290 deg. C to 420 deg. C. As a result, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process such that the problem of separation of the circuit pattern occurring during the plating process can be solved and reliability of product can be improved.