发明名称 |
METAL ROUTING ARCHITECTURE FOR INTEGRATED CIRCUITS |
摘要 |
A device includes a substrate, a metal pad over the substrate, and a metal trace electrically disconnected from the metal pad. The metal pad and the metal trace are level with each other. A passivation layer includes a portion overlapping an edge portion of the metal pad. A metal pillar is overlying the metal pad, and is electrically connected to the metal pad. The metal trace has a portion overlapped by the metal pillar. |
申请公布号 |
KR20140089283(A) |
申请公布日期 |
2014.07.14 |
申请号 |
KR20130065638 |
申请日期 |
2013.06.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHUANG CHITA;CHUANG YAO CHUN;CHEN CHIH HUA;KUO CHEN CHENG;CHEN CHEN SHIEN |
分类号 |
H01L21/60;H01L23/488 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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