| 摘要 |
<p>The present invention relates to a moving device for sputter deposition and, more specifically, to a moving device for sputter deposition with improved target using efficiency capable of preventing plasma from being partially concentrated on a target and of depositing a pattern with the same thickness and width on a substrate by enabling the target to be reciprocated by a driving unit while a magnet is fixed when the pattern is deposited on the surface of the substrate using a sputter deposition process. The moving device for sputter deposition according to the present invention comprises a fixing part having an internal space part; a moving housing installed in the space part to be reciprocated; the magnet positioned inside the moving housing, and fixed on the fixing part; a moving part moved with the moving housing, and having the target, which faces the substrate arranged inside a chamber, to form the pattern on the substrate; and the driving unit for driving the moving part to be reciprocated.</p> |
