RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS

摘要

TO PROVIDE A RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS HAVING LOW GAS PERMEABILITY, LITTLE MOLD CONTAMINATION BY A MOLD RESIN AND A HIGH RELEASABILITY. A GAS BARRIER RELEASE FILM FOR SEMICONDUCTOR RESIN MOLDS, WHICH IS A RELEASE FILM COMPRISING AT LEAST A RELEASE LAYER (I) HAVING EXCELLENT RELEASABILITY AND A PLASTIC SUPPORT LAYER (II) SUPPORTING THE RELEASE LAYER, WHEREIN THE PLASTIC SUPPORT LAYER (II) HAS A STRESS AT A 200% ELONGATION OF FROM 1MPa TO 50 MPa AT 170°C, AND THE RELEASE FILM HAS A XYLENE GAS PERMEABILITY OF AT MOST 5X1O¯¹? (KMOL.M/ (S.M² .KPA)). THE RELEASE FILM (I) IS PREFERABLY FORMED FROM A FLUORORESIN SUCH AS AN ETHYLENE/TETRAFLUOROETHYLENE COPOLYMER, AND THE PLASTIC SUPPORT LAYER (II) IS PREFERABLY FORMED FROM AN ETHYLENE/VINYL ALCOHOL COPOLYMER.